congatec Thermal Management

CPU & Chip Coolers COMe Active Uni Cooler (w/o HSP)

Heat Sinks Standard heatspreader (Heatstack Solution) for Qseven module conga-QMX6 with CPU in NON-LIDDED FCBGA Package.Threaded version (standoffs, M2.5)Intended for following QMX6 modules: * conga-QMX6/DC-1G eMMC4 (P/N 016102A) * conga-QMX6/QC-1G eMMC4 (P/N 0

Heat Sinks Standard Heatspreader for SMARC 2.0 module conga-SA5* For modules with IHS Intel Atom CPU* All stand-offs are bore hole 2.7mm

Heat Sinks Standard passive cooling for COM Express Mini Type10 module conga-MA5* Heatstack cooling for modules with standard CPU (open silicone die)* All stand-offs are M2.5 threaded

CPU & Chip Coolers Standard active cooling solution and integrated 12V fan for conga-JC370 (threaded). 16mm fins, 21mm overall heat sink height and total height 27.3mm.

CPU & Chip Coolers Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with 2.7mm bore hole.

CPU & Chip Coolers Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are with 2.7mm bore hole.

Heat Sinks HSP COMe-mBT10 through

Heat Sinks Standard passive cooling for COM Express Mini Type10 module conga-MA5* For modules with IHS (lidded) CPU* All stand-offs are M2.5 threaded

Heat Sinks HSP COMe-mBT10 thread

Heat Sinks HEATSPREADER FOR conga-QA3 2.7mm

CPU & Chip Coolers Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5.