Mobile Modules

Results: 713
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Description Datasheet Availability Pricing (DKK) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Series
Frequency
Output Power
Interface Type
Supply Voltage - Min
Supply Voltage - Max
Supply Current Transmitting
Supply Current Receiving
Minimum Operating Temperature
Maximum Operating Temperature
Antenna Connector Type
Dimensions
Protocol - Cellular, NBIoT, LTE
Packaging
Quectel Mobile Modules Cat 1 + 3G + 2G module
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 250
Mult.: 250
: 250

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel
Quectel Mobile Modules CAT 1
Datasheet
Non-Stocked
Min.: 250
Mult.: 250
: 250

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel
Quectel Mobile Modules Cat 1 + 3G + 2G, 1Gbit ROM+1Gbit RAM, Latin A, Australia, NZ
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 250
Mult.: 250
: 250

EC/EG21 33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel
Quectel Mobile Modules Cat 1 + 3G + 2G, mPCIe form factor, Latin A, Australia, NZ
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 100
Mult.: 100

EC/EG21 mPCIe 33 dBm I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 40 C + 85 C Pad 51 mm x 30 mm x 4.9 mm LTE Cat 1 Tray
Quectel Mobile Modules
Datasheet
Non-Stocked
Min.: 250
Mult.: 1

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V 17 mA - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1
Quectel Mobile Modules External, 698-2700, LTE (4G), Dipole, 1000 +/-30, SMA Male (center pin) , Adhesive, 152 18 5.9
Datasheet
Non-Stocked
Min.: 1
Mult.: 1

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V 17 mA - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1
Quectel Mobile Modules Cat 1 + 3G + 2G, 1Gbit ROM+1Gbit RAM, Support B28A, EMEA
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1
: 250

EC/EG21 33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel, Cut Tape
Quectel Mobile Modules Cat 1 + 3G + 2G, mPCIe form factor, EMEA
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 100
Mult.: 100

EC/EG21 mPCIe 33 dBm I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 40 C + 85 C Pad 51 mm x 30 mm x 4.9 mm LTE Cat 1 Tray
Quectel Mobile Modules Cat 1, 4Gbit ROM+2Gbit RAM, South Korea only
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 250
Mult.: 250
: 250

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel
Quectel Mobile Modules Cat 1, mPCIe form factor, South Korea
Datasheet
Non-Stocked Lead-Time 26 Weeks
Min.: 100
Mult.: 100
: 100

33 dBm I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V 32 mA - 40 C + 85 C Pad 51 mm x 30 mm x 4.9 mm LTE Cat 1 Reel
Quectel Mobile Modules CAT 1
Datasheet
Non-Stocked
Min.: 250
Mult.: 250
: 250

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel
Quectel Mobile Modules Cat 1, 4Gbit ROM+2Gbit RAM, Verizon (NA)
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1
: 250

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 Reel, Cut Tape
Quectel Mobile Modules
Datasheet
Non-Stocked
Min.: 250
Mult.: 250

ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V 22 mA - 35 C + 75 C 32 mm x 29 mm x 2.4 mm LTE Cat 4
Quectel Mobile Modules Cat 6 Non-Stocked
Min.: 200
Mult.: 200
: 200

ADC, I2C, PCIe, PCIM, RGMII, SDIO, SPI, UART, USB 3.3 V 4.3 V - 20 C + 70 C 39.5 mm x 37 mm x 2.8 mm LTE-A Cat 6 Reel
Quectel Mobile Modules Cat 12
Datasheet
Non-Stocked Lead-Time 26 Weeks
Min.: 200
Mult.: 200
: 200

LTE Reel
Quectel Mobile Modules Cat 12
Non-Stocked
Min.: 200
Mult.: 200
: 200

LTE Reel
Quectel Mobile Modules Cat 1 + 3G + 2G, 1Gbit ROM+1Gbit RAM, Cost down version of EG21-G, VoLTE, BT, Global
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1
: 250

Reel, Cut Tape
Quectel Mobile Modules Cat 1 + 3G + 2G, Cost down version of EG21-G mPCIe, Global
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1

Tray
Quectel Mobile Modules Cat 1 + 3G + 2G, 1Gbit ROM+1Gbit RAM, Cost down version of EG21-G, data only (no VoLTE), Global
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 250
Mult.: 250
: 250

Reel
Quectel Mobile Modules Cat 4 + 3G + 2G, 1Gbit ROM+1Gbit RAM, voice + data, Global
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1
: 250

33 dBm Bluetooth, I2C, PCM, SDIO, SGMII, UART, USB, USIM 3.8 V 3.8 V 22 mA - 35 C + 75 C 32 mm x 29 mm x 2.4 mm LTE Reel, Cut Tape
Quectel Mobile Modules Cat 4 + 3G + 2G, 1Gbit ROM+1Gbit RAM, voice + data, Global, mPCIe form factor
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 100
Mult.: 100
: 100

Reel
Quectel Mobile Modules Cat 4 + 3G + 2G, data only application, Global
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 250
Mult.: 250
: 250

EC/EG30 Reel
Quectel Mobile Modules Cat 4 + 3G + 2G, 2Gbit ROM+2Gbit RAM, data Only, Global, mPCIe form factor
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1

Tray
Quectel Mobile Modules Cat 4 + 3G + 2G, Cost down version of EG25-G, Global
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1
: 250

Reel, Cut Tape
Quectel Mobile Modules Cat 4 + 3G + 2G, Cost down version of EG25-G, MINIPCIE form factor, Global
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1

Tray