MIL-HD2 Next-Gen VITA 91 Connectors

Amphenol Aerospace MIL-HD2 Next-Gen VITA 91 Connectors are developed in alignment with the open group Sensor Open Systems Architecture™ (SOSA™) technical standard. These connectors provide a readily available and robust open architecture solution for tighter card pitches and chassis designs where space requirements and density are critical. The series is designed to achieve 56Gb/s PAM4 data rate requirements with a higher density of 1.8mm pitch. These connectors feature proprietary crosstalk-reducing technologies and show proven EMI and signal integrity advantages. Amphenol MIL-HD2 VITA 91 connectors show improved impedance matching and provide the complete solution to meet the next-gen performance level. These connectors are uniquely designed to meet high-density application requirements. Applications include radar, sensors, switches, integrated processors, surveillance, cyber defense, C5ISR, and low Earth orbit satellites.

Results: 2
Select Image Part # Mfr. Description Datasheet Availability Pricing (DKK) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Number of Positions Number of Rows Termination Style Mounting Angle Current Rating Maximum Data Rate Minimum Operating Temperature Maximum Operating Temperature Contact Plating Contact Material Housing Material Series
Amphenol Aerospace Board to Board & Mezzanine Connectors Module -4pr 8 Column 84In Stock
Min.: 1
Mult.: 1

Connectors 64 Position 8 Row Press Fit Straight 1 A 56 Gbps - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Board Level
Amphenol Aerospace Board to Board & Mezzanine Connectors MHD2 VITA 91
61Expected 23/03/2026
Min.: 1
Mult.: 1

Connectors 64 Position 8 Row Press Fit Straight 1 A 56 Gbps - 40 C + 105 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Mil-HD2