Wakefield Thermal ulTIMiFlux Thermal Material
Wakefield Thermal ulTIMiFlux Thermal Material offers high performance, cost-effectiveness, configurability, and custom sizes for thermal system needs. Thermal Interface Material (TIM) is a secondary material installed between the heat sink and the device and is designed to improve the thermal transfer to the heat sink. The Wakefield Thermal line of dielectric phase change thermal materials are intended to fill voids between a device and the heat sink. The ulTIMiFlux material utilizes a polyimide film to act as a thermally conductive carrier to deliver uniform thickness coating of phase-change thermal compound on both sides. These materials are an effective drop-in-place solution that makes an excellent replacement for thermal greases.
The fully cured dispensable gels eliminate time-consuming hand assembly, decreasing installation costs and reducing manufacturing and purchasing complexity. These products require no mixing or curing and provide a low thermal impedance at thin and thick gaps. This allows the use of common heat spreaders with proven reliability in extreme temperature cycling and shock and vibration conditions.
Features
- Low thermal impedance
- Excellent replacement for thermal greases
- Thixotropic/prevents compound run-out
- Excellent mechanical and dielectric properties
- Cost-effective drop-in-place solution
- RoHS and halogen-free compliant
Fully Cured Dispensable Gels
Additional Resources
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