Samtec XCede® HD High-Density Backplane Systems
Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.
Features
- Up to 84 differential pairs per linear inch
- 1.8mm column pitch
- 3-, 4-, and 6-pair designs
- 4, 6, or 8 columns
- 12 to 48 pairs
- Up to a 3mm contact wipe on signal pins
- Multiple signal/ground pin staging options
- Integrated power, guidance, keying, and sidewall options available
- 85Ω and 100Ω options
- Three levels of sequencing enable hot-plugging
- Cost-effective designs available for low-speed applications
Modular Design Overview
Videos
Daughtercard Assembly
XCede HD Daughtercard Assembly - Fully custom module to meet specific application requirements, combines any number, in any configuration of HDTF (signal), power, and keying/guidance to create one BSP product
Associated Connectors
Samtec XCede® HD HDTF Right-Angle Backplane Receptacles
Features a 1.8mm column pitch and modular design for flexibility in applications.
Samtec XCede® HD HDTM 1.8mm Vertical Backplane Headers
Features a 1.8mm column pitch, keying, guidance, and up to 3mm contact wipe on signal pins.
Samtec XCede® HD HPTS 3.20mm Power Modules
Feature press-fit tails and come in a variety of body heights to match signal module pair count.
Samtec HPTT XCede® HD Power Modules
Offers a 1.8mm pitch and a small form factor for significant space savings.
Published: 2019-04-26
| Updated: 2025-02-19