TE Connectivity AMPMODU System 50/50 Grid
TE Connectivity's (TE) AMPMODU 50/50 Grid Connector Family features a variety of high-density board-to-board and wire-to-board connectors with a 0.050" x 0.050" (1.27mm x 1.27mm) pitch. The series is categorized into three groups: board-mount headers, board-mount receptacles, and cable-to-board receptacles. They are available in double row, vertical or right angle, shrouded, and from 10 up to 100 positions. The TE AMPMODU 50/50 series is formed from high conductivity copper alloy and selectively plated with gold for higher performance and reliability. Applications include medical equipment, storage equipment, automotive controls, servers, robotics, and much more.
Features
- Categorized into three groups: board-mount headers, board-mount receptacles, and cable-to-board receptacles
- Available in double row, vertical or right angle, shrouded, from 10 up to 100 positions
- Housings on all board-mounted assemblies are made of high-temperature tolerant materials, all available in SMD technology and incorporate stand-offs for free drainage of flux cleaning solutions
- Formed from high conductivity copper alloy and selectively plated with gold for higher performance and reliability
- Integral latches for positive locking to shrouded mating headers
- Suitable for high-density systems
- Mechanical hold downs to aid in solder processing
- Three available board stack heights offer flexibility in mezzanine application architecture
Applications
- Medical equipment
- Storage equipment
- Automotive controls
- Infotainment systems
- Servers
- Test/measurement devices
- Factory automation
- Robotics
- Telecommunication equipment
- Appliances
- Aerospace and defense equipment
System Example
Additional Resources
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TE Connectivity AMPMODU Interconnection System
Provides connections with a unique modular concept, utilizing precision-formed receptacle contacts.
Published: 2013-11-07
| Updated: 2025-03-13