Laird Technologies Tflex™ HD90000 Thermal Gap Filler
Laird Technologies Tflex™ HD90000 Thermal Gap Filler features a combination of 7.5W/mK thermal conductivity with superior pressure vs. deflection characteristics. This silicone-based thermal gap filler minimizes board and component stress. The ceramic-filled silicon sheets are offered in a variety of thicknesses ranging from 0.020" to 0.200". Laird Technologies Tflex™ HD90000 Thermal Gap Filler is an environmentally friendly solution that meets regulatory requirements, including RoHS and REACH.
Features
- Ceramic-filled silicon sheets
- Low pressure versus deflection
- Excellent surface wetting for low contact resistance
- Minimizes board and component stress
- Low outgassing
- Large tolerance applications
- Environmentally friendly solution that meets regulatory requirements
- RoHS and REACH compliant
Applications
- Automotive
- Consumer
- Industrial
- Telecommunications
Specifications
- 7.5W/mK thermal conductivity
- 3.5g/cc density
- Low D3-D20 (<20ppm)
- 0.020" to 0.20" thickness range
- -50°C to +125°C temperature range
Related Gap Fillers
Laird Technologies Tflex™ HD7.5 Thermal Gap Filler
Soft silicone material that offers high deflection and 7.5W/mK thermal conductivity.
Laird Technologies Tflex™ RB300 Thermal Gap Filler
Exceptionally soft gap filler pads with a thermal conductivity of 1.2 W/mK.
Related Solutions
Laird Technologies Thermal Interface Solutions
Designed to meet the challenges of today's electronics, which are smaller but more powerful.
Published: 2021-04-28
| Updated: 2025-06-17