Alliance Memory ASFC Series 5.1 e·MMC

Alliance Memory ASFC Series 5.1 e·MMC is a compact storage solution with a single-chip MMC controller and NAND flash memory. Alliance Memory ASFC is designed for data storage and booting, prioritizing efficient read operations at low power. 3D TLC NAND technology offers an Enhanced mode (pSLC) for demanding industrial use, supported by an industrial temperature grade specification. The e·MMC controller handles NAND flash management, including ECC, wear-leveling, IOPS optimization, and read sensing. The device supports high throughput for large data transfers and excels in handling small random data often found in code. Additionally, it includes security features, multiple boot partitions, and advanced refresh for read-intensive applications. Communication is facilitated via an 11-signal bus, following the JEDEC e·MMC standard known as e·MMC mode.

Features

JEDEC eMMC standard version 5.1 compliant
eMMC 5.1 enhanced:
- 11-signal interface (including CMD, CLK, DAT[7:0], and RST_n)
- 1-bit, 4-bit, and 8-bit programmable bus width
- Supports HS400 high-speed interface timing mode up to 400MB/s data rate
- Up to 200MHz clock frequency
- Supports eMMC Field Firmware Update (FFU)
- Supports eMMC Production State Awareness (PSA)
- Supports eMMC device health report
- High-speed and dual data rate boot support
- Supports boot and alternative boot mode
- Replay Protected Memory Block (RPMB)
- Trim, sanitize, discard, secure erase, and secure trim
- Enhanced partition attributes
- High Priority Interrupt (HPI)
- Background operations
- Enhanced reliable write
- Supports command queuing
- Supports enhanced strobe in HS400 mode
- Supports eMMC background operation control
- Supports eMMC configuration up to 8 general-purpose partitions and 4 RPMB regions
- Supports eMMC CMDQ enhanced data task
- Supports eMMC CMDQ device management operation

Robust data protection and endurance:
- Configurable ECC engine with zero overhead pipeline greatly reduces data loss rates and increases
- data endurance
- Enhanced write protection with permanent, temporary, and power-on protection options
- Static Data Refresh and early retirement technologies ensure data reliability
- Power Shield and DataPhoenix technologies support power-down data protection
Global wear leveling maximizes product lifespan with minimal wear leveling and write amplification overhead
Supply voltage:
- eMMC interface power (VCCQ): 1.70V to 1.95V
- eMMC interface power (VCCQ): 2.7V to 3.6V
- NAND memory power (VCC): 2.7V to 3.6V
Dynamic power management technology enables multiple power-saving modes
Multiple densities and packages:
- Available in 64GB, 128GB, 256GB, and 512GB full 3D TLC mode density
- 153-ball standard BGA packages
- Green Package and RoHS compliant