i.MX 8ULP Crossover Applications Processors

NXP Semiconductors i.MX 8ULP Crossover Applications Processors brings ultra-low power processing and advanced integrated security with EdgeLock® secure enclave to the intelligent edge. EdgeLock secure enclave is pre-configured to simplify complex security implementations. The i.MX 8ULP devices feature NXP’s Energy Flex architecture that combines heterogeneous domain computing, design techniques, and process technology. A dedicated power management subsystem offers more than twenty power mode combinations to deliver exceptional efficiency across various applications.

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NXP Semiconductors Processors - Application Specialised 8ULP, Dual Cortex A35
Datasheet
1.200In Stock
Min.: 1
Mult.: 1

Processors - Application Specialized SMD/SMT FCBGA-512 ARM Cortex A35 32 bit 800 MHz 32 kB 32 kB 64 kB - 40 C + 105 C Tray
NXP Semiconductors Processors - Application Specialised i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
Datasheet
25In Stock
Min.: 1
Mult.: 1

Processors - Application Specialized SMD/SMT FCBGA-512 ARM Cortex A35 32 bit 800 MHz 32 kB 32 kB 64 kB - 40 C + 105 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
Datasheet
1.128In Stock
Min.: 1
Mult.: 1

RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 85 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
Datasheet
487In Stock
Min.: 1
Mult.: 1

RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 105 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
Datasheet
25In Stock
Min.: 1
Mult.: 1
RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 85 C Tray
NXP Semiconductors Processors - Application Specialised i.MX 8ULP: Arm Cortex -A35 and Cortex-M33 for ultra low-power, energy efficient applications
Datasheet
25Expected 29/10/2026
Min.: 1
Mult.: 1

Processors - Application Specialized SMD/SMT FCBGA-512 ARM Cortex A35 32 bit 800 MHz 32 kB 32 kB 64 kB - 40 C + 105 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33 for ultra low-power, energy efficient applications
Datasheet
25Expected 29/10/2026
Min.: 1
Mult.: 1
RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 85 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33 for ultra low-power, energy efficient applications
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 630
Mult.: 630

RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 105 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33 for ultra low-power, energy efficient applications
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 630
Mult.: 630

RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 85 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
Datasheet
Lead-Time 16 Weeks
Min.: 1
Mult.: 1

RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 105 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 630
Mult.: 630

RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 85 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1
Mult.: 1

RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 85 C Tray
NXP Semiconductors Processors - Application Specialised i.MX 8ULP: Arm Cortex -A35 and Cortex-M33 for ultra low-power, energy efficient applications
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1.200
Mult.: 1.200

Processors - Application Specialized SMD/SMT FCBGA-512 ARM Cortex A35 32 bit 800 MHz 32 kB 32 kB 64 kB - 40 C + 105 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33 for ultra low-power, energy efficient applications
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 630
Mult.: 630

RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 105 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33 for ultra low-power, energy efficient applications
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1.200
Mult.: 1.200
RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 85 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33 for ultra low-power, energy efficient applications
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 630
Mult.: 630

RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 85 C Tray
NXP Semiconductors Processors - Application Specialised i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1.200
Mult.: 1.200

Processors - Application Specialized SMD/SMT FCBGA-512 ARM Cortex A35 32 bit 800 MHz 32 kB 32 kB 64 kB - 40 C + 105 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1
Mult.: 1

RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 105 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1.200
Mult.: 1.200
RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 85 C Tray
NXP Semiconductors RF System on a Chip - SoC i.MX 8ULP: Arm Cortex -A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 630
Mult.: 630

RF System on a Chip - SoC SMD/SMT ARM Cortex A35 - 40 C + 85 C Tray