It appears you have JavaScript disabled within your browser. Some functions on this page will not work unless you log in.

See an Error?

MICROFC-10020-SMT-TR

Name: onsemi MICROFC-10020-SMT-TR
Brand: onsemi
SKU: 863-MFC10020SMTTR
Price: 75.27 DKK
Availability: InStock

Images are for reference only
See Product Specifications

Mouser No:

863-MFC10020SMTTR

Mfr. No:

MICROFC-10020-SMT-TR

Mfr.:

onsemi

Description:

Photodiodes C-SERIES 1MM 20U MLP

Datasheet:

MICROFC-10020-SMT-TR Datasheet

ECAD Model:

Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

More Information

Learn more about onsemi MICROFC-10020-SMT-TR

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

Product Attribute	Attribute Value	Select Attribute
Manufacturer:	onsemi
Product Category:	Photodiodes
RoHS:
Product:	Photodiode Arrays
Mounting Style:	SMD/SMT
Peak Wavelength:	420 nm
Dark Current:	5 nA
Rise Time:	0.3 ns
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Series:	C Series SIPM
Brand:	onsemi
Moisture Sensitive:	Yes
Packaging:	Reel
Product Type:	Photodiodes
Factory Pack Quantity:	3000
Subcategory:	Optical Detectors & Sensors
Tradename:	SensL

Products found:

To show similar products, select at least one checkbox

Select at least one checkbox above to show similar products in this category.

Attributes selected: 0

Filter Document:

Datasheet

MICROFC-10020-SMT-TR Datasheet

PCN

Product Catalogs

Product Selection Guide (PDF)

Technical Resources

TSV Handling Guide (PDF)

Compliance Codes

USHTS:: 8541491050
ECCN:: EAR99

Origin Classifications

Country of Origin:: Japan
Assembly Country of Origin:: Thailand
Country of Diffusion:: Japan

The country is subject to change at the time of shipment.

C-Series Silicon Photomultiplier (SiPM) Sensors

onsemi C-Series Silicon Photomultiplier (SiPM) Sensors feature industry-leading low dark count rates of 30kHz/mm², in combination with exceptional breakdown voltage uniformity of ±250mV. The high photon detection efficiency (PDE) extends far into the blue part of the spectrum using a high-volume, CMOS process. These sensors are available in 1mm, 3mm and 6mm sizes and a variety of microcell sizes. They are packaged in a tileable moulded lead-frame (MLP) package that is compatible with industry standard, lead-free, reflow soldering processes. The C-Series also features a unique fast output for fast timing applications.

Silicon Photomultipliers (SiPMs)

onsemi Silicon Photomultipliers (SiPMs) feature high gain, fast timing, and excellent PDE with practical advantages associated with solid state technology (SST). These onsemi SiPMs offer a fast output terminal and are manufactured using a CMOS process. The SiPMs have a breakdown voltage uniformity of ±250mV across all sensors in a product line, a low-temperature coefficient of 21mV/°C, and <30V bias voltage. These SiPMs are ideal for medical imaging, hazard and threat, 3D ranging and imaging, and high energy physics.

Electric Commercial Agricultural Vehicles (eCAVs)

onsemi Electric Commercial Agricultural Vehicles (eCAVs) are transforming modern agriculture, replacing diesel and gasoline engines with battery-electric, hybrid-electric, and range-extended drivetrains across tractors, harvesters, sprayers, loaders, utility and transport vehicles, and autonomous field robots. Advancements in lithium-ion and LFP batteries, government incentives, rising fuel and maintenance costs, and growing pressure to reduce emissions have helped drive the global eCAV market from $2.0 billion in 2025 to $4.63 billion by 2031, representing a 14.99% CAGR. The result is quieter, lower-maintenance machines that deliver instant torque, regenerative braking, and lower operating costs per hour.

C-Series Array SiPM Sensors

onsemi C-Series Array Silicon Photomultiplier (SiPM) Sensors are used to create compact and scalable arrays. The MLP-packaged sensors are mounted onto PCB boards with minimal dead space and are available in a variety of formats, formed of sensors of either 1mm, 3mm or 6mm. The back of each Array-C has either multi-way connectors or a ball grid array (BGA), to give access to the fast and standard outputs, and a common I/O from the summed substrates of the pixels.