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FGA66XABM2

Name: Quectel FGA66XABM2
Brand: Quectel
SKU: 277-FGA66XABM2
Price: 203.73 DKK
Availability: OutOfStock

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Mouser No:

277-FGA66XABM2

Mfr. No:

FGA66XABM2

Mfr.:

Quectel

Description:

Multiprotocol Development Tools Development/Evaluation Board for use with FGA66XABMD

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

FGA66XABM2 Datasheet (PDF)

More Information

Learn more about Quectel FGA66XABM2

Shipping Alert:

Product available only to OEM/EMS and design business customers. Product is not shipped to consumers in the EU or the UK. This product will require additional documentation to export from the United States.

Availability

Stock:: 0

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On Order:: 100

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Pricing (DKK)

Qty.	Unit Price	Ext. Price
	203,73 kr.	203,73 kr.

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Quectel
Product Category:	Multiprotocol Development Tools
Delivery Restrictions:	Product available only to OEM/EMS and design business customers. Product is not shipped to consumers in the EU or the UK. This product will require additional documentation to export from the United States.
Product:	Development Boards
Tool Is For Evaluation Of:	FGA66XABMD
Operating Supply Voltage:	3.14 V to 3.46 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Protocol - Bluetooth, BLE - 802.15.1:	Bluetooth
Protocol - WiFi - 802.11:	WiFi
Brand:	Quectel
For Use With:	WiFi, Bluetooth Module
Product Type:	Multiprotocol Development Tools
Subcategory:	Development Tools

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Datasheet

FGA66XABM2 Datasheet (PDF)

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

FGA66X Wi-Fi 6, BLE 5.4 & IEEE 802.15.4 Modules

Quectel FGA66X Wi-Fi 6, BLE 5.4, and IEEE 802.15.4 Modules are high-performance modules in an LGA package and support the IEEE 802.11ax standard protocol. These modules operate at MCS 0 to MCS 9 rates over a 20MHz bandwidth and 256QAM. The FGA66X modules are designed with a reliable SDIO 3.0 and USB interface to provide WLAN capability. The low profile and small size of the LGA package enable the modules to be easily embedded in size-constrained applications and to provide reliable connectivity. The FGA66X modules are available in an ultra-compact size of 23mm x 14mm x 2.2mm to meet the demands of size-sensitive applications. These modules operate over a wide temperature range of -40°C to 85°C and are available in an LGA package. The FGA66X modules are ideal for a variety of smart home and industrial applications.