Mezalok High-Speed Low-Force XMC Connectors

TE Connectivity’s (TE) Mezalok High-Speed Low-Force (HSLF) XMC Connectors are designed for rugged embedded computing interconnects in mezzanine applications. The HSLF connectors utilise a rugged dual point contact system that meets the qualification requirements of legacy Mezalok high-speed connectors and a reliable ball grid array printed circuit board surface-mount application. These Mezalok High-Speed Low-Force XMC Connectors meet the same rugged standards as listed in VITA 47 and VITA 72. The 114-position connector is compliant with VITA 61 and is available in various positions and stack heights.

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Description Datasheet Availability Pricing (DKK) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Product
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Pitch
Number of Rows
Termination Style
Mounting Angle
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Minimum Operating Temperature
Maximum Operating Temperature
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TE Connectivity Board to Board & Mezzanine Connectors 60 Position, 1.27mm CL, Gold, Vertical
Datasheet
448In Stock
Min.: 1
Mult.: 1

Receptacles 60 Position 1.27 mm (0.05 in) 6 Row Solder Balls Vertical 12 mm 1.5 A - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP)
TE Connectivity Board to Board & Mezzanine Connectors 114 Position, 1.27mm Gold, Vertical
Datasheet
374In Stock
Min.: 1
Mult.: 1

Receptacles 114 Position 1.27 mm (0.05 in) 6 Row Solder Balls Vertical 10 mm 1.5 A 250 VAC 32 Gbps - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 32 Gbps
TE Connectivity Board to Board & Mezzanine Connectors 60 Position, 1.27mm CL, Gold, Vertical
Datasheet
345In Stock
Min.: 1
Mult.: 1
: 450
No
Receptacles 60 Position 1.27 mm (0.05 in) 6 Row Solder Balls Vertical 12 mm 1.5 A - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) Reel, Cut Tape
TE Connectivity Board to Board & Mezzanine Connectors 60 Position, 1.27mm CL, Gold, Vertical
Datasheet
421In Stock
Min.: 1
Mult.: 1

Receptacles 60 Position 1.27 mm (0.05 in) 6 Row Solder Balls Vertical 10 mm 1.5 A - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP)


TE Connectivity Board to Board & Mezzanine Connectors 60 Position, 1.27mm CL, Gold
Datasheet
354In Stock
Min.: 1
Mult.: 1
: 450

Receptacles 60 Position 1.27 mm (0.05 in) 6 Row Solder Balls Vertical 10 mm 1.5 A - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) Reel, Cut Tape
TE Connectivity Board to Board & Mezzanine Connectors 114 Position, 1.27mm Gold, Vertical
Datasheet
9In Stock
Min.: 1
Mult.: 1
: 350

Receptacles 114 Position 1.27 mm (0.05 in) 6 Row Solder Balls Vertical 12 mm 1.5 A 250 VAC 32 Gbps - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 32 Gbps Reel, Cut Tape
TE Connectivity Board to Board & Mezzanine Connectors 114 Position, 1.27mm, Gold, Vertical
Datasheet
Non-Stocked Lead-Time 44 Weeks
No
Receptacles 114 Position 1.27 mm (0.05 in) 6 Row Solder Balls Vertical 10 mm 1.5 A 250 VAC 32 Gbps - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 32 Gbps
TE Connectivity Board to Board & Mezzanine Connectors 114 Position, 1.27mm Gold, Vertical
Datasheet
Non-Stocked Lead-Time 36 Weeks

Receptacles 114 Position 1.27 mm (0.05 in) 6 Row Solder Balls Vertical 12 mm 1.5 A 250 VAC 32 Gbps - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) 32 Gbps Reel