QFN Style Solder-Down Computer On Module
Ka-Ro Electronics QFN Style Solder-Down Computer On Module (COM) is single-sided, assembled in a small square size of 27mm and a height of 2.6mm. This module features a QFN-type lead style with a 1mm pitch and 100 pads. The QFN-style solder-down module is industrial-grade and features an RGB display interface, 2x USB connectivity, and an Arm® Cortex®-A55 1.4GHz NXP i.MX 91 processor. The Ka-Ro Electronics QS91 series is ideal for industrial, IoT, and medical applications.
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