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THSF-ID7-B

Name: ADLINK Technology THSF-ID7-B
Brand: ADLINK Technology
SKU: 976-THSF-ID7-B
Price: 790.69 DKK
Availability: OutOfStock

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Mouser No:

976-THSF-ID7-B

Mfr. No:

THSF-ID7-B

Mfr.:

ADLINK Technology

Description:

Heat Sinks High profile heatsink with fan for Express-ID7 with threaded standoffs

Datasheet:

THSF-ID7-B Datasheet

ECAD Model:

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More Information

Learn more about ADLINK Technology THSF-ID7-B

Availability

Stock:: 0

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Factory Lead Time:: 18 Weeks Estimated factory production time.

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Minimum: 1 Multiples: 1

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Ext. Price:

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Est. Tariff:

This Product Ships FREE

Pricing (DKK)

Qty.	Unit Price	Ext. Price
	790,69 kr.	790,69 kr.
	727,57 kr.	7.275,70 kr.
	679,01 kr.	16.975,25 kr.
	654,76 kr.	32.738,00 kr.
	630,67 kr.	63.067,00 kr.
250	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	ADLINK Technology
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sinks
Brand:	ADLINK Technology
Product Type:	Heat Sinks
Factory Pack Quantity:	1
Subcategory:	Heat Sinks
Type:	High Profile Heatsink

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Datasheet

THSF-ID7-B Datasheet

CAHTS:: 8473309000
USHTS:: 8473305100
JPHTS:: 847330090
MXHTS:: 8473300499
ECCN:: EAR99

Express-ID7 Module

ADLINK Technology Express-ID7 Module is powered by the Intel® Xeon® D-1700 processor and offers integrated high-speed Ethernet (up to 4x 10G). The ADLINK Technology Express-ID7 also features 16 PCIe Gen4 lanes for immediate responsiveness. The device incorporates Intel® technologies like TCC, Deep Learning Boost (VNNI), and AVX-512 for accelerated AI performance. The Express-ID7 supports Time Sensitive Networking (TSN) for precisely controlling real-time workloads across networked devices. This rugged and edge AI-focused COM, featuring Intel® Ice Lake-D, empowers system integrators for diverse applications, including edge networking, robotics, autonomous driving, 5G, and more.