W631GU6NB-12

Winbond
454-W631GU6NB-12
W631GU6NB-12

Mfr.:

Description:
DRAM 1Gb DDR3L 1.35V SDRAM, x16, 800MHz

Lifecycle:
Verify Status with Factory:
Lifecycle information is unclear. Obtain a quote to verify the availability of this part number from the manufacturer.
Datasheet:
ECAD Model:
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More Information
Learn more about Winbond W631GU6NB-12

In Stock: 639

Stock:
639 Can Dispatch Immediately
Factory Lead Time:
53 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 639 will be subject to minimum order requirements.
Long lead time reported on this product.
Minimum: 1   Multiples: 1   Maximum: 198
Unit Price:
-,-- kr.
Ext. Price:
-,-- kr.
Est. Tariff:

Pricing (DKK)

Qty. Unit Price
Ext. Price
21,86 kr. 21,86 kr.
20,44 kr. 204,40 kr.
19,92 kr. 498,00 kr.
19,47 kr. 973,50 kr.
19,02 kr. 1.902,00 kr.

Product Attribute Attribute Value Select Attribute
Winbond
Product Category: DRAM
RoHS:  
SDRAM - DDR3L
1 Gbit
16 bit
800 MHz
VFBGA-96
64 M x 16
20 ns
1.283 V
1.45 V
0 C
+ 95 C
Tray
Brand: Winbond
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: TW
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Product Type: DRAM
Factory Pack Quantity: 198
Subcategory: Memory & Data Storage
Supply Current - Max: 78 mA
Products found:
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Attributes selected: 0

CNHTS:
8542329000
CAHTS:
8542320020
USHTS:
8542320032
MXHTS:
8542320299
ECCN:
EAR99

DRAM Product Portfolio

Winbond DRAM Product Portfolio consists of Mobile RAM and Specialty DRAM for consumer, communication, peripheral, industrial, and automobile markets. Specialty DRAM features high performance and a high speed for a complete solution. The SDR, DDR, DDR2, and DDR3 feature support for industrial and automotive applications with AEC-Q100, TS16949, ISO9001/14001, OHSAS18001 certificates. Winbond provides professional advice to KGD customers, including SiP package bonding and power/thermal, DRAM simulation, and wafer level on speed tests.

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