1180-4009

Amphenol / SV Microwave
523-1180-4009
1180-4009

Mfr.:

Description:
RF Adapters - In Series 3mm F to F Bullet Adapter

ECAD Model:
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In Stock: 4

Stock:
4 Can Dispatch Immediately
Factory Lead Time:
14 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- kr.
Ext. Price:
-,-- kr.
Est. Tariff:
This Product Ships FREE

Pricing (DKK)

Qty. Unit Price
Ext. Price
991,28 kr. 991,28 kr.
877,00 kr. 8.770,00 kr.
824,18 kr. 16.483,60 kr.
801,13 kr. 40.056,50 kr.
788,45 kr. 78.845,00 kr.
200 Quote

Product Attribute Attribute Value Select Attribute
Amphenol
Product Category: RF Adapters - In Series
RoHS:  
REACH - SVHC:
3 mm
Jack (Female)
Jack (Female)
50 Ohms
40 GHz
Tray
Brand: Amphenol / SV Microwave
Frequency Range: 40 GHz
Product Type: RF Adapters - In Series
Series: 3mm
Side 1 RF Series: 3 mm
Side 2 RF Series: 3 mm
Factory Pack Quantity: 100
Subcategory: RF Adapters
Products found:
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Attributes selected: 0

CNHTS:
8536901100
CAHTS:
8536690010
USHTS:
8536694010
JPHTS:
853669000
MXHTS:
85366999
BRHTS:
85366990
ECCN:
EAR99

5G Connectors, Adapters & Cable Assemblies

Amphenol / SV Microwave 5G Connectors, Adapters, and Cable Assemblies offer >26GHz frequency levels and specialise in the precision RF frequency bands that 5G requires. RF solutions for the 5G series include LiteTouch connectors, Solderless Edge Launch Connectors, Mini-D RF Connection Systems, and  Solderless PCB Connectors. The Amphenol / SV Microwave 5G family is ideal for test equipment, striplines, military and aerospace applications, depending on the model. 

3mm Board-to-Board Interconnects

Amphenol SV Microwave 3mm Board-to-Board Interconnects feature 3mm board-to-board spacing and a minimum pitch of .150" between adjacent connectors. These connectors offer a DC to 40GHz frequency range. The series provides the lowest stacked height of any board-to-board high-frequency coaxial connection system. Amphenol SV Microwave 3mm Board-to-Board Interconnects are ideal for use in embedded computing, high-density stacked PCB applications, and high-density multiport applications.