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DIP (Dual In-Line Package) Sockets

TE Connectivity's (TE) DIP (Dual In-Line Package) Sockets feature two contact configuration options for application flexibility: four-finger and dual leaf. The sockets provide a separable electrical and mechanical connection between the electronic component and the PCB, supporting quick mating and un-mating capability. The DIP sockets are available in open-frame and closed-frame housing with end-to-end and side-to-side stackable options. The DIP sockets' optimised design minimises the risk of the integrated circuit (IC) overheating during soldering and provides improved vibration resistance via the multi-contact beam design. The TE DIP Sockets are ideal for industrial controls, intelligent buildings, medical devices, military and other embedded system applications.