2485264-2

TE Connectivity
571-2485264-2
2485264-2

Mfr.:

Description:
IC & Component Sockets DIP IC SOCKET 14P-Sn

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

In Stock: 7.105

Stock:
7.105 Can Dispatch Immediately
Factory Lead Time:
9 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- kr.
Ext. Price:
-,-- kr.
Est. Tariff:

Pricing (DKK)

Qty. Unit Price
Ext. Price
9,10 kr. 9,10 kr.
7,76 kr. 77,60 kr.
6,80 kr. 170,00 kr.
6,42 kr. 616,32 kr.
6,16 kr. 1.576,96 kr.
5,87 kr. 3.005,44 kr.
5,59 kr. 5.724,16 kr.
5,39 kr. 13.625,92 kr.

Product Attribute Attribute Value Select Attribute
TE Connectivity
Product Category: IC & Component Sockets
RoHS:  
Sockets
14 Position
2 Row
DIP Socket
2.54 mm
Through Hole
Tin
7.62 mm
- 55 C
+ 125 C
Tube
Brand: TE Connectivity
Contact Material: Copper
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Current Rating: 1 A
Flammability Rating: UL 94 V-0
Housing Material: Thermoplastic (TP)
Mounting Style: PCB Mount
Product Type: IC & Component Sockets
Factory Pack Quantity: 32
Subcategory: IC & Component Sockets
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

This functionality requires JavaScript to be enabled.

TARIC:
8536693000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
BRHTS:
85366990
ECCN:
EAR99

DIP (Dual In-Line Package) Sockets

TE Connectivity's (TE) DIP (Dual In-Line Package) Sockets feature two contact configuration options for application flexibility: four-finger and dual leaf. The sockets provide a separable electrical and mechanical connection between the electronic component and the PCB, supporting quick mating and un-mating capability. The DIP sockets are available in open-frame and closed-frame housing with end-to-end and side-to-side stackable options. The DIP sockets' optimised design minimises the risk of the integrated circuit (IC) overheating during soldering and provides improved vibration resistance via the multi-contact beam design. The TE DIP Sockets are ideal for industrial controls, intelligent buildings, medical devices, military and other embedded system applications.