78349-2004

Molex
538-78349-2004
78349-2004

Mfr.:

Description:
High Speed/Modular Connectors Impact Pwr 4Pr RAHdr HDn PF.76AuLF 4Ckt

ECAD Model:
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In Stock: 287

Stock:
287 Can Dispatch Immediately
Factory Lead Time:
8 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- kr.
Ext. Price:
-,-- kr.
Est. Tariff:

Pricing (DKK)

Qty. Unit Price
Ext. Price
100,86 kr. 100,86 kr.
87,43 kr. 874,30 kr.
82,88 kr. 2.072,00 kr.
81,61 kr. 4.080,50 kr.
72,06 kr. 7.206,00 kr.
61,84 kr. 15.460,00 kr.

Product Attribute Attribute Value Select Attribute
Molex
Product Category: High Speed/Modular Connectors
RoHS:  
Headers
4 Position
2 Row
5.2 mm
Press Fit
Gold
78349
Tray
Brand: Molex
Contact Material: Tin
Current Rating: 20 A
Housing Colour: Black
Housing Material: Liquid Crystal Polymer (LCP)
Maximum Operating Temperature: + 85 C
Minimum Operating Temperature: - 55 C
Mounting Angle: Right Angle
Product Type: High Speed / Modular Connectors
Factory Pack Quantity: 50
Subcategory: Backplane Connectors
Tradename: Impact
Voltage Rating: 250 V
Part # Aliases: 0783492004 783492004
Unit Weight: 12,614 g
Products found:
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Attributes selected: 0

TARIC:
8536693000
CNHTS:
8538900000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
85366999
BRHTS:
85366990
ECCN:
EAR99

Impact Backplane Connector System

Molex Impact Backplane System features data rates up to and beyond 25Gbps plus superior signal density of up to 30 pairs per cm. This system pushes the density envelope to meet next generation high-speed demands with one of the most versatile offerings in the market. Molex Impact Backplane System has a simple 1.90mm by 1.35mm grid that provides PCB routing flexibility.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.