ChipConnect Internal Cable Assemblies

TE Connectivity's ChipConnect Internal Faceplate-to-Processor Cable Assemblies are designed for Intel Omni-Path Architecture (OPA), which can directly transmit signals from the processor to the faceplate. ChipConnect cable assemblies mate directly with LGA 3647 sockets at the processor. The assemblies connect with Intel Omni-Path Internal Faceplate Transition (IFT) connector at the faceplate for 25Gbps speeds. 

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Description Datasheet Availability Pricing (DKK) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Product
Connector End A
Connector End A Pin Count
Connector End B
Connector End B Pin Count
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TE Connectivity / AMP Specialised Cables IFP B/INV LEC STR CBL ASSY 1PORT 160MM
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 100
Mult.: 100

Power Cables Receptacle 54 Position Plug 28 Position 160 mm Male / Female
TE Connectivity Specialised Cables IFP A/INV LEC STR CBL ASSY 2PORT 208MM
Datasheet
Non-Stocked Lead-Time 17 Weeks
Min.: 100
Mult.: 100

Power Cables Plug 54 Position Plug 28 Position 208 mm Male / Male