Mezalok High-Speed Low-Force XMC Connectors

TE Connectivity’s (TE) Mezalok High-Speed Low-Force (HSLF) XMC Connectors are designed for rugged embedded computing interconnects in mezzanine applications. The HSLF connectors utilise a rugged dual point contact system that meets the qualification requirements of legacy Mezalok high-speed connectors and a reliable ball grid array printed circuit board surface-mount application. These Mezalok High-Speed Low-Force XMC Connectors meet the same rugged standards as listed in VITA 47 and VITA 72. The 114-position connector is compliant with VITA 61 and is available in various positions and stack heights.

Results: 8
Select Image Part # Mfr. Description Datasheet Availability Pricing (DKK) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Number of Positions Pitch Number of Rows Termination Style Mounting Angle Stack Height Current Rating Voltage Rating Maximum Data Rate Minimum Operating Temperature Maximum Operating Temperature Contact Plating Contact Material Housing Material Packaging
TE Connectivity Board to Board & Mezzanine Connectors 60 Position, 1.27mm CL, Gold, Vertical 448In Stock
Min.: 1
Mult.: 1

Receptacles 60 Position 1.27 mm (0.05 in) 6 Row Solder Balls Vertical 12 mm 1.5 A - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP)
TE Connectivity Board to Board & Mezzanine Connectors 60 Position, 1.27mm CL, Gold, Vertical 350In Stock
Min.: 1
Mult.: 1
Reel: 450
No
Receptacles 60 Position 1.27 mm (0.05 in) 6 Row Solder Balls Vertical 12 mm 1.5 A - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) Reel, Cut Tape
TE Connectivity Board to Board & Mezzanine Connectors 114 Position, 1.27mm Gold, Vertical 442In Stock
Min.: 1
Mult.: 1

Receptacles 114 Position 1.27 mm (0.05 in) 6 Row Solder Balls Vertical 10 mm 1.5 A 250 VAC 32 Gbps - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP)


TE Connectivity Board to Board & Mezzanine Connectors 60 Position, 1.27mm CL, Gold 354In Stock
Min.: 1
Mult.: 1
Reel: 450
No
Receptacles 60 Position 1.27 mm (0.05 in) 6 Row Solder Balls Vertical 10 mm 1.5 A - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) Reel, Cut Tape
TE Connectivity Board to Board & Mezzanine Connectors 114 Position, 1.27mm Gold, Vertical 76In Stock
Min.: 1
Mult.: 1
Reel: 350

Receptacles 114 Position 1.27 mm (0.05 in) 6 Row Solder Balls Vertical 12 mm 1.5 A 250 VAC 32 Gbps - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) Reel, Cut Tape
TE Connectivity Board to Board & Mezzanine Connectors 60 Position, 1.27mm CL, Gold, Vertical 431In Stock
Min.: 1
Mult.: 1

Receptacles 60 Position 1.27 mm (0.05 in) 6 Row Solder Balls Vertical 10 mm 1.5 A - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP)
TE Connectivity Board to Board & Mezzanine Connectors 114 Position, 1.27mm Gold, Vertical 90In Stock
Min.: 1
Mult.: 1
Reel: 350
No
Receptacles 114 Position 1.27 mm (0.05 in) 6 Row Solder Balls Vertical 12 mm 1.5 A 250 VAC 32 Gbps - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) Reel, Cut Tape
TE Connectivity Board to Board & Mezzanine Connectors 114 Position, 1.27mm, Gold, Vertical Non-Stocked Lead-Time 24 Weeks
No
Receptacles 114 Position 1.27 mm (0.05 in) 6 Row Solder Balls Vertical 10 mm 1.5 A 250 VAC 32 Gbps - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP)