ATS-HK379-R0

Advanced Thermal Solutions
984-ATS-HK379-R0
ATS-HK379-R0

Mfr.:

Description:
Heat Sinks Cooler Backing Plate, High Performance, 96x96x6mm, 80mm Hole to Hole, Aluminum

ECAD Model:
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In Stock: 649

Stock:
649 Can Dispatch Immediately
Factory Lead Time:
13 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- kr.
Ext. Price:
-,-- kr.
Est. Tariff:

Pricing (DKK)

Qty. Unit Price
Ext. Price
24,84 kr. 24,84 kr.
23,20 kr. 232,00 kr.
22,60 kr. 565,00 kr.
21,34 kr. 1.067,00 kr.
20,07 kr. 2.007,00 kr.
18,80 kr. 4.700,00 kr.
18,13 kr. 9.065,00 kr.
17,16 kr. 17.160,00 kr.

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Accessories and Hardware
96 mm
96 mm
Brand: Advanced Thermal Solutions
Product Type: Heat Sinks
Series: ATS-HK
Factory Pack Quantity: 1
Subcategory: Heat Sinks
Type: Backing Plate
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Attributes selected: 0

CAHTS:
8473309000
USHTS:
8473305100
JPHTS:
847330090
MXHTS:
8473300499
ECCN:
EAR99

ATS-HK379-R0 High-Performance Cooler Backing Plate

Advanced Thermal Solutions ATS-HK379-R0 High-Performance Cooler Backing Plate is an optional backing plate that connects CPUs and other high-powered processors to the Ultra-Cool family of high-performance passive and active thermal solutions, including dual-FLOW™ and quadFLOW™. The ATS-HK379-R0 is designed for CPUs, processors, GPUs, AI processors, and FPGAs that fit sockets other than the Intel™ LGA2011 square and LGA2066 (Socket R). This plate comes with an unattached die-cut Formex GK-10 insulator to provide electrical insulation between the board and the backing plate. ATS High-Performance Cooler Backing Plate measures 96mm x 96mm with 70mm x 70mm inner dimensions and is intended for use with 1.57mm thick PCB. The ATS-HK379-R0 easily attaches beneath the PCB for even pressure across the board to prevent cracking or other damage.