LMG2100R026VBNR

Texas Instruments
595-LMG2100R026VBNR
LMG2100R026VBNR

Mfr.:

Description:
Gate Drivers 100V 2.6m? half-brid ge gallium nitride

Lifecycle:
New Product:
New from this manufacturer.
Datasheet:
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Learn more about Texas Instruments LMG2100R026VBNR

In Stock: 24.535

Stock:
24.535 Can Dispatch Immediately
Factory Lead Time:
12 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- kr.
Ext. Price:
-,-- kr.
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 2500)

Pricing (DKK)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
81,39 kr. 81,39 kr.
65,13 kr. 651,30 kr.
63,11 kr. 1.577,75 kr.
54,76 kr. 5.476,00 kr.
52,37 kr. 13.092,50 kr.
47,74 kr. 23.870,00 kr.
47,59 kr. 47.590,00 kr.
Full Reel (Order in multiples of 2500)
39,69 kr. 99.225,00 kr.
† A MouseReel™ fee of 47,00 kr. will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
Texas Instruments
Product Category: Gate Drivers
RoHS:  
Gate Drivers
Half-Bridge
SMD/SMT
VQFN-16
1 Driver
1 Output
8 A
4.75 V
5.25 V
- 40 C
+ 125 C
LMG2100R026
Reel
Cut Tape
MouseReel
Brand: Texas Instruments
Features: Low Power Consumption
Input Voltage - Max: 5.25 V
Input Voltage - Min: 4.75 V
Moisture Sensitive: Yes
Output Voltage: 12 V
Product Type: Gate Drivers
Propagation Delay - Max: 55 ns
Rds On - Drain-Source Resistance: 3.5 mOhms
Shutdown: No Shutdown
Factory Pack Quantity: 2500
Subcategory: PMIC - Power Management ICs
Technology: Si
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Attributes selected: 0

Datasheet

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CNHTS:
8542399000
USHTS:
8542390090
MXHTS:
8542399999
ECCN:
EAR99

LMG2100R026 GaN Half-Bridge Power Stage

Texas Instruments LMG2100R026 GaN Half-Bridge Power Stage integrates gate-driver and enhancement-mode Gallium Nitride (GaN) FETs. The 93V continuous, 100V pulsed, 53A half-bridge power stage includes two GaN FETs driven by one high-frequency GaN FET driver in a half-bridge configuration. The driver and the two GaN FETs are mounted on a fully bond-wire-free package platform with minimized package parasitic elements.

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