IRFB4020PBF

Infineon Technologies
942-IRFB4020PBF
IRFB4020PBF

Mfr.:

Description:
MOSFETs MOSFT 200V 100mOhm 18A 18nC Qg for Aud

Datasheet:
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Learn more about Infineon Technologies IRFB4020PBF

In Stock: 2.340

Stock:
2.340
Can Dispatch Immediately
On Order:
2.000
Expected 25/02/2026
Factory Lead Time:
20
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- kr.
Ext. Price:
-,-- kr.
Est. Tariff:

Pricing (DKK)

Qty. Unit Price
Ext. Price
11,56 kr. 11,56 kr.
4,38 kr. 43,80 kr.
4,37 kr. 437,00 kr.
3,78 kr. 1.890,00 kr.
3,54 kr. 3.540,00 kr.
3,35 kr. 6.700,00 kr.
3,30 kr. 16.500,00 kr.

Product Attribute Attribute Value Select Attribute
Infineon
Product Category: MOSFETs
RoHS:  
Si
Through Hole
TO-220-3
N-Channel
1 Channel
200 V
18 A
100 mOhms
- 20 V, 20 V
1.8 V
18 nC
- 55 C
+ 175 C
100 W
Enhancement
Tube
Brand: Infineon Technologies
Configuration: Single
Fall Time: 6.3 ns
Forward Transconductance - Min: 24 S
Product Type: MOSFETs
Rise Time: 12 ns
Factory Pack Quantity: 1000
Subcategory: Transistors
Transistor Type: 1 N-Channel
Typical Turn-Off Delay Time: 16 ns
Typical Turn-On Delay Time: 7.8 ns
Unit Weight: 2 g
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TARIC:
8541290000
CNHTS:
8541290000
CAHTS:
8541290000
USHTS:
8541290065
JPHTS:
8541290100
KRHTS:
8541299000
MXHTS:
85412999
ECCN:
EAR99

Power MOSFETs

Infineon pioneered HEXFET power MOSFET technology, developing and introducing the first hexagonal topology MOSFETs in 1979. These developments were granted a broad patent just four years later, and since that time, most MOSFET manufacturers have licensed the designs and processes to enter this marketplace. IR products exhibit the lowest MOSFET on-resistance available on the market for similar components in their class, enabling power conversion subsystem designs that exhibit unequaled efficiency. IR combines state-of-the-art silicon technology with innovative packaging technology. IR POWIRTAB™, Super-220™, and Super-247™ packages allow up to 20A more current per device in the same footprint than standard packages, increasing power density. Compatible with standard surface-mount soldering techniques, IR's FlipFET® packaging technology offers a 100% silicon-to-footprint ratio with the same performance as a conventional package three times as big, making it the ideal solution for portable devices such as phones or notebook PCs. IR's DirectFET® packaging revolutionizes thermal management in the footprint of a standard SO-8 by drawing heat away from the board through the top of the package. As a result, DirectFET MOSFETs can double the current density while cutting thermal management costs in half in high-current circuits that power next-generation microprocessors.

200V to 250V HEXFET® Power MOSFETs

Infineon 200V to 250V HEXFET® Power MOSFETs offer a broad range of MOSFETs in various packages, current and RDS(on) ratings. These 200V to 250V HEXFET Power MOSFETs utilize the latest processing techniques to achieve low on-resistance per silicon area. This benefit, combined with fast switching speed and ruggedized device design provides an extremely efficient and reliable device for use in a wide variety of applications.

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