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2445893-1

Name: TE Connectivity 2445893-1
Brand: TE Connectivity
SKU: 571-2445893-1
Price: 7.53 DKK
Availability: InStock

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Mouser No:

571-2445893-1

Mfr. No:

2445893-1

Mfr.:

TE Connectivity

Description:

IC & Component Sockets DIP IC SOCKET 8P SMT

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

2445893-1 Datasheet

ECAD Model:

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More Information

Learn more about TE Connectivity 2445893-1

In Stock: 4.275

Stock:: 4.275 Can Dispatch Immediately

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Factory Lead Time:: 14 Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

Unit Price:

-,-- kr.

Ext. Price:

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Est. Tariff:

Pricing (DKK)

Qty.	Unit Price	Ext. Price
	7,53 kr.	7,53 kr.
	6,36 kr.	63,60 kr.
	5,68 kr.	142,00 kr.
	5,41 kr.	541,00 kr.
	5,07 kr.	1.267,50 kr.
Full Reel (Order in multiples of 500)
	4,92 kr.	2.460,00 kr.
	4,55 kr.	4.550,00 kr.
	4,42 kr.	11.050,00 kr.

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	TE Connectivity
Product Category:	IC & Component Sockets
RoHS:
Product:	Sockets
Number of Positions:	8 Position
Number of Rows:	2 Row
Type:	DIP Socket
Pitch:	2.54 mm
Termination Style:	SMD/SMT
Contact Plating:	Tin
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 125 C
Packaging:	Reel
Packaging:	Cut Tape
Brand:	TE Connectivity
Contact Material:	Copper
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Current Rating:	1 A
Flammability Rating:	UL 94 V-0
Housing Material:	Thermoplastic (TP)
Mounting Style:	PCB Mount
Product Type:	IC & Component Sockets
Factory Pack Quantity:	500
Subcategory:	IC & Component Sockets

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Datasheet

2445893-1 Datasheet

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USHTS:: 8536694040
ECCN:: EAR99

DIP (Dual In-Line Package) Sockets

TE Connectivity's (TE) DIP (Dual In-Line Package) Sockets feature two contact configuration options for application flexibility: four-finger and dual leaf. The sockets provide a separable electrical and mechanical connection between the electronic component and the PCB, supporting quick mating and un-mating capability. The DIP sockets are available in open-frame and closed-frame housing with end-to-end and side-to-side stackable options. The DIP sockets' optimised design minimises the risk of the integrated circuit (IC) overheating during soldering and provides improved vibration resistance via the multi-contact beam design. The TE DIP Sockets are ideal for industrial controls, intelligent buildings, medical devices, military and other embedded system applications.