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TT160N16SOFHPSA1

Name: Infineon TT160N16SOFHPSA1
Brand: Infineon Technologies
SKU: 726-TT160N16SOFHPSA1
Price: 329.88 DKK
Availability: InStock

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Mouser No:

726-TT160N16SOFHPSA1

Mfr. No:

TT160N16SOFHPSA1

Mfr.:

Infineon Technologies

Description:

Thyristor Modules L#T-BOND MODULE

Datasheet:

TT160N16SOFHPSA1 Datasheet (PDF)

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In Stock: 3

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Factory Lead Time:: 24 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (DKK)

Qty.	Unit Price	Ext. Price
	329,88 kr.	329,88 kr.
	246,33 kr.	1.970,64 kr.

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Infineon
Product Category:	Thyristor Modules
RoHS:
Gate Trigger Current - Igt:	145 mA
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 125 C
Mounting Style:	Screw Mount
Packaging:	Tray
Brand:	Infineon Technologies
Holding Current Ih Max:	200 mA
Product Type:	Thyristor Modules
Factory Pack Quantity:	8
Subcategory:	Discrete and Power Modules
Technology:	Si
Type:	Thyristor
Part # Aliases:	TT160N16SOF SP001495450
Unit Weight:	165 g

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Datasheet

TT160N16SOFHPSA1 Datasheet (PDF)

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TARIC:: 8541300000
CNHTS:: 8504409190
CAHTS:: 8541300000
USHTS:: 8541300080
JPHTS:: 854130000
ECCN:: EAR99

Eco Block Solder Bond Modules

Infineon Eco Block Solder Bond Modules are ideal for applications where the high robustness of pressure contact technology is not necessarily a must. Typical applications are drives, power supplies, and soft starters. Designers benefit from improved terminal design for symmetric current sharing and the 100% x-ray monitoring of solder process which leads to predictably high performance and lifetime. With the second generation for 34mm, you can get increased current ratings (up to 240A).

Solder Bond Power Block IGBT Modules

Infineon Solder Bond Power Block IGBT Modules are bipolar power modules that are in a solder bond technology to address the specific requirements of cost-effective applications. These Power Block modules expands its already comprehensive power module portfolio which, so far, was only using pressure contacts. With market prices of approximately 25 percent (depending on module/application) less than related pressure contact variants solder bond modules offer significant cost advantages in modules with smaller packages sizes of up to 50mm. The small solder Power Block modules are ideal for applications like standard drives or UPS, where the high robustness of pressure contacts is not necessarily a must.