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TD190N16SOFHPSA2

Name: Infineon TD190N16SOFHPSA2
Brand: Infineon Technologies
SKU: 726-TD190N16SOFHPSA2
Price: 336.15 DKK
Availability: InStock

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Mouser No:

726-TD190N16SOFHPSA2

Mfr. No:

TD190N16SOFHPSA2

Mfr.:

Infineon Technologies

Description:

Discrete Semiconductor Modules L#T-BOND MODULE

Datasheet:

TD190N16SOFHPSA2 Datasheet (PDF)

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In Stock: 16

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Factory Lead Time:: 24 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (DKK)

Qty.	Unit Price	Ext. Price
	336,15 kr.	336,15 kr.
	251,92 kr.	2.015,36 kr.

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Infineon
Product Category:	Discrete Semiconductor Modules
RoHS:
Product:	Thyristor-Diode Modules
Type:	Phase Control
Technology:	Si
Vr - Reverse Voltage:	1.6 kV
Mounting Style:	Screw Mount
Package/Case:	PB34
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 125 C
Packaging:	Tray
Brand:	Infineon Technologies
Configuration:	SCR/Diode Phase Control
Gate Trigger Current - Igt:	145 mA
Holding Current Ih Max:	200 mA
Id - Continuous Drain Current:	30 mA
Product Type:	Discrete Semiconductor Modules
Factory Pack Quantity:	8
Subcategory:	Discrete and Power Modules
Typical Delay Time:	2 us
Typical Turn-Off Delay Time:	320 us
Part # Aliases:	TD190N16SOF SP001206284
Unit Weight:	165 g

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Datasheet

TD190N16SOFHPSA2 Datasheet (PDF)

Application Notes

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CNHTS:: 8504901900
USHTS:: 8541300080
ECCN:: EAR99

Eco Block Solder Bond Modules

Infineon Eco Block Solder Bond Modules are ideal for applications where the high robustness of pressure contact technology is not necessarily a must. Typical applications are drives, power supplies, and soft starters. Designers benefit from improved terminal design for symmetric current sharing and the 100% x-ray monitoring of solder process which leads to predictably high performance and lifetime. With the second generation for 34mm, you can get increased current ratings (up to 240A).

Solder Bond Power Block IGBT Modules

Infineon Solder Bond Power Block IGBT Modules are bipolar power modules that are in a solder bond technology to address the specific requirements of cost-effective applications. These Power Block modules expands its already comprehensive power module portfolio which, so far, was only using pressure contacts. With market prices of approximately 25 percent (depending on module/application) less than related pressure contact variants solder bond modules offer significant cost advantages in modules with smaller packages sizes of up to 50mm. The small solder Power Block modules are ideal for applications like standard drives or UPS, where the high robustness of pressure contacts is not necessarily a must.