FK20X5R0J226MN000

TDK
810-FK20X5R0J226M
FK20X5R0J226MN000

Mfr.:

Description:
Multilayer Ceramic Capacitors MLCC - Leaded SUGGESTED ALTERNATE 810-FG20X7R1C226MRT6

Lifecycle:
NRND:
Not recommended for new designs.
ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

In Stock: 1.511

Stock:
1.511 Can Dispatch Immediately
Factory Lead Time:
40 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- kr.
Ext. Price:
-,-- kr.
Est. Tariff:

Pricing (DKK)

Qty. Unit Price
Ext. Price
5,71 kr. 5,71 kr.
3,30 kr. 33,00 kr.
2,62 kr. 262,00 kr.
2,58 kr. 1.290,00 kr.
2,43 kr. 2.430,00 kr.
1,61 kr. 4.025,00 kr.
1,54 kr. 7.700,00 kr.
1,48 kr. 14.800,00 kr.
1,45 kr. 36.250,00 kr.

Product Attribute Attribute Value Select Attribute
TDK
Product Category: Multilayer Ceramic Capacitors MLCC - Leaded
RoHS:  
FK
Radial
22 uF
6.3 VDC
X5R
20 %
5 mm
Dipped
- 55 C
+ 85 C
General Type MLCCs
7 mm
5.5 mm
4 mm
Bulk
Brand: TDK
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Lead Style: Inside Kink
Product Type: Ceramic Capacitors
Factory Pack Quantity: 500
Subcategory: Capacitors
Type: Dipped Radial Lead Commercial Grade
Part # Aliases: FK20X5R0J226MN000 -
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

TARIC:
8532240000
CNHTS:
8532249000
CAHTS:
8532240090
USHTS:
8532240060
JPHTS:
853224000
KRHTS:
8532240000
MXHTS:
8532240400
BRHTS:
85322490
ECCN:
EAR99

FK Dipped Radial Ceramic Capacitors

TDK FK General and Mid-Voltage Dipped Radial Ceramic Capacitors provide large electrostatic capacity while maintaining a high level of reliability. FK capacitors feature a residual inductance that is small and provides good frequency characteristics. TDK FK series features leads that are formed with a kink to achieve consistent insertion heights and facilitate the release of gases during soldering for dramatically improved solderability.