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DD180N16SHPSA1

Name: Infineon DD180N16SHPSA1
Brand: Infineon Technologies
SKU: 726-DD180N16SHPSA1
Price: 312.8 DKK
Availability: InStock

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Mouser No:

726-DD180N16SHPSA1

Mfr. No:

DD180N16SHPSA1

Mfr.:

Infineon Technologies

Description:

Diode Modules L#T-BOND MODULE

Datasheet:

DD180N16SHPSA1 Datasheet (PDF)

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In Stock: 18

Stock:: 18

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On Order:: 16

Expected 16/07/2026
Factory Lead Time:: 24

Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

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Pricing (DKK)

Qty.	Unit Price	Ext. Price
	312,80 kr.	312,80 kr.
	230,81 kr.	1.846,48 kr.

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Infineon
Product Category:	Diode Modules
RoHS:
Mounting Style:	Screw Mount
Package/Case:	PB34
Vr - Reverse Voltage:	1.6 kV
Vf - Forward Voltage:	1.39 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 135 C
Packaging:	Tray
Brand:	Infineon Technologies
Product Type:	Diode Modules
Factory Pack Quantity:	8
Subcategory:	Discrete and Power Modules
Technology:	Si
Part # Aliases:	DD180N16S SP001495438
Unit Weight:	165 g

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Datasheet

DD180N16SHPSA1 Datasheet (PDF)

Application Notes

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CNHTS:: 8504409190
USHTS:: 8541100080
ECCN:: EAR99

Eco Block Solder Bond Modules

Infineon Eco Block Solder Bond Modules are ideal for applications where the high robustness of pressure contact technology is not necessarily a must. Typical applications are drives, power supplies, and soft starters. Designers benefit from improved terminal design for symmetric current sharing and the 100% x-ray monitoring of solder process which leads to predictably high performance and lifetime. With the second generation for 34mm, you can get increased current ratings (up to 240A).

Solder Bond Power Block IGBT Modules

Infineon Solder Bond Power Block IGBT Modules are bipolar power modules that are in a solder bond technology to address the specific requirements of cost-effective applications. These Power Block modules expands its already comprehensive power module portfolio which, so far, was only using pressure contacts. With market prices of approximately 25 percent (depending on module/application) less than related pressure contact variants solder bond modules offer significant cost advantages in modules with smaller packages sizes of up to 50mm. The small solder Power Block modules are ideal for applications like standard drives or UPS, where the high robustness of pressure contacts is not necessarily a must.