9711S

Name: 3M 9711S
Brand: 3M Electronic Specialty
SKU: 517-9711S
Price: 732.5 DKK
Availability: InStock

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Mouser No:

517-9711S

Mfr. No:

9711S

Mfr.:

3M Electronic Specialty

Description:

Adhesive Tapes Electrically Conductive Double-Sided Tape 9711S, 25 mm x 10 m, 100um

Datasheet:

9711S Datasheet (PDF)

More Information

Learn more about 3M Electronic Specialty 9711S

In Stock: 73

Stock:: 73

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On Order:: 24

12

Pending

12

Expected 19/02/2026
Factory Lead Time:: 6

Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

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Ext. Price:

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Est. Tariff:

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Pricing (DKK)

Qty.	Unit Price	Ext. Price
	732,50 kr.	732,50 kr.
	648,20 kr.	7.778,40 kr.
	648,12 kr.	18.147,36 kr.
	594,86 kr.	30.932,72 kr.
	583,07 kr.	58.307,00 kr.

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	3M
Product Category:	Adhesive Tapes
RoHS:
Product:	Tapes
Type:	Conductive
Description/Function:	Electrically Conductive Double-Sided Tape
Color:	Gray
Adhesive Type:	Acrylic
Width - in:	0.984 in
Width - mm:	25 mm
Length - mm:	10000 mm
Brand:	3M Electronic Specialty
Packaging:	Roll
Product Type:	Adhesive Tapes
Series:	9711
Factory Pack Quantity:	4
Subcategory:	Supplies
Thickness:	100 uM
Part # Aliases:	7100160646
Unit Weight:	118,610 g

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Datasheet

9711S Datasheet (PDF)

TARIC:: 3919108090
CNHTS:: 3919109900
USHTS:: 4811411000
ECCN:: EAR99

Thermally Conductive Interface Pads

3M™ Thermally Conductive Interface Pads are designed to provide a preferential heat transfer path between heat-generating components, heat sinks, and other cooling devices. The interface pads consist of a highly conformable and slightly tacky silicone elastomer with thermally conductive ceramic particles, which help in providing enhanced thermal conductivity and excellent insulation performance. The high thermal conductivity and dielectric strength pads can be die-cut to fit individual applications. Typical applications include Integrated Circuit (IC) chip packaging heat conduction, heat sink interface, LED board Thermal Interface Material (TIM), and Chip ON Film (COF) heat conduction.