W25N01GWTCIG

Winbond
454-W25N01GWTCIG
W25N01GWTCIG

Mfr.:

Description:
NAND Flash 1G-bit Serial NAND flash, 1.8V

Lifecycle:
Verify Status with Factory:
Lifecycle information is unclear. Obtain a quote to verify the availability of this part number from the manufacturer.
Datasheet:
ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.
More Information
Learn more about Winbond W25N01GWTCIG

In Stock: 1.675

Stock:
1.675 Can Dispatch Immediately
Factory Lead Time:
24 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 1675 will be subject to minimum order requirements.
Long lead time reported on this product.
Minimum: 1   Multiples: 1   Maximum: 480
Unit Price:
-,-- kr.
Ext. Price:
-,-- kr.
Est. Tariff:

Pricing (DKK)

Qty. Unit Price
Ext. Price
32,75 kr. 32,75 kr.
30,06 kr. 300,60 kr.
29,62 kr. 740,50 kr.

Product Attribute Attribute Value Select Attribute
Winbond
Product Category: NAND Flash
RoHS:  
SMD/SMT
TFBGA-24
W25N01GW
1 Gbit
SPI
128 M x 8
Asynchronous
8 bit
1.7 V
1.95 V
35 mA
- 40 C
+ 85 C
Tray
Active Read Current - Max: 35 mA
Brand: Winbond
Maximum Clock Frequency: 104 MHz
Moisture Sensitive: Yes
Product Type: NAND Flash
Factory Pack Quantity: 480
Subcategory: Memory & Data Storage
Tradename: SpiFlash
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

Datasheet

PCN

CNHTS:
8542329090
CAHTS:
8542320040
USHTS:
8542320051
MXHTS:
8542320299
ECCN:
3A991.b.1.b.1

QspiNAND Flash Memory

Winbond QspiNAND Flash Memory is high-performance, low-power memory built with Single-Level Cell (SLC) memory technology and implementing 1-bit Error Correction Code (ECC) on all read and write operations. The integrated ECC detects and corrects errors and enables contiguous good memory (bad block management). This feature offloads these functions from an external controller. The QspiNAND Flash Memory also supports Executive-in-Place (XiP) functionality, in which an SoC or processor executes application code directly from the external flash memory without shadowing it to DRAM.

NAND Product Portfolio

Winbond NAND Product Portfolio consists of Serial NAND, High-Performance Serial NAND, and SLC NAND Flash. The SLC NAND Parallel flash memories are offered in densities from 1GB through 4GB (16GB for QspiNAND memory) in JEDEC standard packages. SLC NAND is compliant with the ONFi standard. As an extension to the SpiNOR family, Winbond offers Serial NAND products in 1GB and 2GB densities with special features like continuous read. This facilitates fast data transfer between Flash and DRAM on system designs. The Serial NAND products have built-in ECC and bad block management, simplifying NAND management.

FEATURED PRODUCTS
WINBOND

Supplier Image
View All Newest Products from Winbond

An unexpected error has occurred.


Have a question? Please visit the Help Centre.
For questions about a specific order, please log in to your account.

If you encounter further problems, please contact us on 800-346-6873 or email help@mouser.com.