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903-23-1-28-2-B-0

Name: Wakefield Thermal 903-23-1-28-2-B-0
Brand: Wakefield Thermal
SKU: 567-903-23-1-28-2-B
Price: 45.13 DKK
Availability: OutOfStock

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Mouser No:

567-903-23-1-28-2-B

Mfr. No:

903-23-1-28-2-B-0

Mfr.:

Wakefield Thermal

Description:

Heat Sinks Chipset Heat Sink with Clip, Elliptical, 23mm Chip Size, 27.6mm Height, Aluminum

Datasheet:

903-23-1-28-2-B-0 Datasheet (PDF)

ECAD Model:

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Availability

Stock:: Non-Stocked

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Factory Lead Time:: 16 Weeks Estimated factory production time.

Enter Quantity:

Minimum: 300 Multiples: 300

Unit Price:

-,-- kr.

Ext. Price:

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Est. Tariff:

This Product Ships FREE

Pricing (DKK)

Qty.	Unit Price	Ext. Price
	45,13 kr.	13.539,00 kr.
	43,42 kr.	26.052,00 kr.
	41,85 kr.	50.220,00 kr.

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Wakefield Thermal
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sink Assemblies
Designed for:	Component, 23mm
Mounting Style:	Clip
Heatsink Material:	Aluminum
Fin Style:	Omnidirectional Fin
Brand:	Wakefield Thermal
Color:	Black
Product Type:	Heat Sinks
Series:	900
Factory Pack Quantity:	300
Subcategory:	Heat Sinks
Type:	Component

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Datasheet

903-23-1-28-2-B-0 Datasheet (PDF)

Images

RoHS Certificate (PDF)

USHTS:: 8473302000
ECCN:: EAR99

900 Series Elliptical Fin Heat Sinks

Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are designed for airflow applications, including telecom, data centers, networking, cloud computing, and other industries. The heat sinks are constructed of AL 6063 material with a black anodized finish. Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are RoHS compliant and compatible with devices from a wide range of suppliers, including Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and more.