TMP110D3IDPWR

Texas Instruments
595-TMP110D3IDPWR
TMP110D3IDPWR

Mfr.:

Description:
Board Mount Temperature Sensors +/-1.0C accurate IC temperature sensor w

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

In Stock: 4.361

Stock:
4.361 Can Dispatch Immediately
Factory Lead Time:
12 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- kr.
Ext. Price:
-,-- kr.
Est. Tariff:

Pricing (DKK)

Qty. Unit Price
Ext. Price
2,12 kr. 2,12 kr.
1,84 kr. 9,20 kr.
1,61 kr. 16,10 kr.
1,53 kr. 76,50 kr.
1,45 kr. 145,00 kr.
1,30 kr. 650,00 kr.
1,25 kr. 1.250,00 kr.
1,22 kr. 2.440,00 kr.
Full Reel (Order in multiples of 3000)
1,13 kr. 3.390,00 kr.

Product Attribute Attribute Value Select Attribute
Texas Instruments
Product Category: Board Mount Temperature Sensors
RoHS:  
Digital
+/- 1 C
- 40 C
+ 125 C
X2SON-5
I2C
1.14 V
5.5 V
Local
12 bit
Shutdown
SMD/SMT
Reel
Cut Tape
Brand: Texas Instruments
Country of Assembly: CN
Country of Diffusion: US
Country of Origin: CN
Product: Digital Temperature Sensors
Product Type: Board Mount Temperature Sensor ICs
Series: TMP110
Factory Pack Quantity: 3000
Subcategory: Sensors
Type: Accurate Ultra Small Sensor
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

This functionality requires JavaScript to be enabled.

TARIC:
8542399000
USHTS:
8542390090
MXHTS:
8542399999
ECCN:
EAR99

TMP110 I2C-Compatible Digital Temperature Sensors

Texas Instruments TMP110 I2C-Compatible Digital Temperature Sensors come in an ultra-small (0.64mm2) 5-pin package. The small size and height of the package optimize volume-constrained systems, which DSBGA packages can be considered unsuitable. Unlike DSBGA packages of comparable size, the TMP110 provides a 5th pin that can be used as an address or alert pin. This feature provides flexibility for scalability of the number of sensors or monitoring critical thermal events.