1MM-R-D25-VS-00-H-TBP

TE Connectivity
571-1MMRD25VS00HTBP
1MM-R-D25-VS-00-H-TBP

Mfr.:

Description:
Board to Board & Mezzanine Connectors SCL 1.0 RCPT DR VT 050 SMT G3 TBK

Lifecycle:
Factory Special Order:
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Datasheet:
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Learn more about TE Connectivity 1MM-R-D25-VS-00-H-TBP

In Stock: 520

Stock:
520 Can Dispatch Immediately
Factory Lead Time:
9 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 520 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- kr.
Ext. Price:
-,-- kr.
Est. Tariff:

Pricing (DKK)

Qty. Unit Price
Ext. Price
61,62 kr. 61,62 kr.
49,76 kr. 1.044,96 kr.
44,39 kr. 4.660,95 kr.
39,69 kr. 10.001,88 kr.

Product Attribute Attribute Value Select Attribute
TE Connectivity
Product Category: Board to Board & Mezzanine Connectors
RoHS:  
Receptacles
50 Position
1 mm (0.039 in)
2 Row
Solder
Vertical
1 A
30 VAC
- 55 C
+ 125 C
Gold
Copper Alloy
Liquid Crystal Polymer (LCP)
Tube
Brand: TE Connectivity
Flammability Rating: UL 94 V-0
Insulation Resistance: 500 MOhms, 1 GOhms
Mounting Style: SMD/SMT
Product Type: Board to Board & Mezzanine Connectors
Factory Pack Quantity: 21
Subcategory: Board to Board & Mezzanine Connectors
Part # Aliases: 2-2267440-5
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Attributes selected: 0

Datasheet

Models

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TARIC:
8536693000
CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

AMPMODU 1.0mm Centreline Interconnect System

TE Connectivity's (TE) AMPMODU 1.0mm Centerline Interconnect System offers an 85% space savings on the board when compared to the standard 2.54mm pitch connectors. A dual-beam contact design provides a reliable electrical connection even in severe shock/vibration environments. The TE AMPMODU 1.0mm Centerline Interconnect System serves a broad range of design requirements with up to 100 positions and two plating options with support for automated surface mounting and reflow processes.

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