DA14706-00000HZ2

Renesas / Dialog
724-DA14706-00000HZ2
DA14706-00000HZ2

Mfr.:

Description:
RF System on a Chip - SoC Multi-core wireless MCU for Bluetooth 5.2 and proprietary 2G4 protocols

Datasheet:
ECAD Model:
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Learn more about Renesas / Dialog DA14706-00000HZ2

In Stock: 3.206

Stock:
3.206 Can Dispatch Immediately
Factory Lead Time:
18 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 3206 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- kr.
Ext. Price:
-,-- kr.
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 4000)

Pricing (DKK)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
86,54 kr. 86,54 kr.
71,69 kr. 716,90 kr.
66,92 kr. 1.673,00 kr.
61,17 kr. 6.117,00 kr.
58,11 kr. 14.527,50 kr.
56,40 kr. 28.200,00 kr.
55,35 kr. 55.350,00 kr.
Full Reel (Order in multiples of 4000)
55,35 kr. 221.400,00 kr.
† A MouseReel™ fee of 47,00 kr. will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
Renesas Electronics
Product Category: RF System on a Chip - SoC
RoHS:  
Bluetooth
ARM Cortex M33
2.4 GHz
6 Mbps
6 dBm
- 97 dBm
2.9 V
4.75 V
1.85 mA
3 mA
4 kB, 32 kB
- 40 C
+ 85 C
VFBGA-142
Reel
Cut Tape
MouseReel
Brand: Renesas / Dialog
Data RAM Size: 1.5 MB
Maximum Clock Frequency: 160 MHz, 2.4 GHz
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Number of I/Os: 79 I/O
Product Type: RF System on a Chip - SoC
Series: DA14706
Factory Pack Quantity: 4000
Subcategory: Wireless & RF Integrated Circuits
Technology: Si
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Attributes selected: 0

Datasheet

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CNHTS:
8542319092
USHTS:
8542310070
ECCN:
5A992.C

DA14706 Highly Integrated Advanced Wireless MCU

Renesas / Dialog DA14706 Highly Integrated Advanced Wireless MCU has integrated application processors, 2D Graphics processors, Voice Activity Detector (VAD), and Power Management Unit (PMU).  It's the only product in the BLUETOOTH® LE space to offer this level of integration. This allows for cost-effective and reliable form factor designs for complex sensor and graphical processing applications.

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