NVT4557HKX

NXP Semiconductors
771-NVT4557HKX
NVT4557HKX

Mfr.:

Description:
Translation - Voltage Levels SIM card interface level translator and supply voltage without LDO

ECAD Model:
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In Stock: 3.500

Stock:
3.500 Can Dispatch Immediately
Factory Lead Time:
16 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- kr.
Ext. Price:
-,-- kr.
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 4000)

Pricing (DKK)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
5,01 kr. 5,01 kr.
4,72 kr. 47,20 kr.
4,21 kr. 105,25 kr.
4,02 kr. 402,00 kr.
3,64 kr. 1.820,00 kr.
3,39 kr. 3.390,00 kr.
Full Reel (Order in multiples of 4000)
2,95 kr. 11.800,00 kr.
2,78 kr. 22.240,00 kr.
† A MouseReel™ fee of 47,00 kr. will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Product Attribute Attribute Value Select Attribute
NXP
Product Category: Translation - Voltage Levels
RoHS:  
Voltage Level Translator
XQFN-10
1.98 V
1.08 V
NVT4557
15 ns
- 40 C
+ 85 C
SMD/SMT
Reel
Cut Tape
MouseReel
Brand: NXP Semiconductors
Operating Supply Current: 10 uA
Product Type: Translation - Voltage Levels
Factory Pack Quantity: 4000
Subcategory: Logic ICs
Part # Aliases: 935404593115
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TARIC:
8542399000
CNHTS:
8542399000
CAHTS:
8542390000
USHTS:
8542390090
MXHTS:
8542399999
ECCN:
EAR99

NVT4557 SIM Card Interface Level Translator

NXP Semiconductors NVT4557 SIM Card Interface Level Translator is intended for interfacing a SIM card with a single low-voltage 1.08V to 1.98V host-side interface. The NVT4557 includes three 1.62V to 3.6V level translators to convert the data, RSTn, and CLKn signals between a SIM card and a host microcontroller. The NXP NVT4557 SIM Card Interface Level Translator is compliant with all ETSI, IMT-2000, and ISO-7816 SIM/Smart card interface requirements.

Logic

NXP Semiconductors Logic portfolio consists of the industry’s smallest, leadless DQFN package for gates, octals, and MSI functions simplifying PCB routing, and the world’s smallest MicroPak™ and Diamond™ packages for single-, dual-, and triple-gate logic. We NXP continually invests in new process and package technologies, as well as new packaging facilities, focus on increasing performance, lowering power consumption, and reducing size and have the largest portfolio of dedicated Q100 devices.