BTS6201UJ

NXP Semiconductors
771-BTS6201UJ
BTS6201UJ

Mfr.:

Description:
RF Amplifier BTS6201U

Lifecycle:
End of Life:
Scheduled for obsolescence and will be discontinued by the manufacturer.
ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

In Stock: 3.550

Stock:
3.550 Can Dispatch Immediately
Factory Lead Time:
13 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- kr.
Ext. Price:
-,-- kr.
Est. Tariff:

Pricing (DKK)

Qty. Unit Price
Ext. Price
27,38 kr. 27,38 kr.
23,65 kr. 236,50 kr.
22,38 kr. 559,50 kr.
19,77 kr. 1.977,00 kr.
18,80 kr. 4.700,00 kr.
16,86 kr. 8.430,00 kr.
15,52 kr. 15.520,00 kr.
15,07 kr. 37.675,00 kr.
Full Reel (Order in multiples of 6000)
14,92 kr. 89.520,00 kr.

Product Attribute Attribute Value Select Attribute
NXP
Product Category: RF Amplifier
RoHS:  
BTS6201U
Reel
Cut Tape
Brand: NXP Semiconductors
Product Type: RF Amplifier
Factory Pack Quantity: 6000
Subcategory: Wireless & RF Integrated Circuits
Part # Aliases: 934072167118
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

This functionality requires JavaScript to be enabled.

TARIC:
8542330000
USHTS:
8542330001
ECCN:
EAR99

RF-IF Solutions

NXP Semiconductors RF-IF Solutions meet the needs of the most demanding RF applications by allowing designers to meet the highest specifications for performance while still retaining potential trade-offs with respect to efficiency, power, ruggedness, consistency, and integration levels. The NXP RF-IF portfolio covers the majority of communication and transmission systems, making it easy to find a solution that matches a designer's particular requirements. NXP RF-IF solutions include the SA6xx Series RF/IF building blocks that are ideal for a variety of niche handheld RF products. Available in small-footprint packages, SA6xx solutions save PCB space while providing better RF performance.