1008F-1R5J-01

Fastron
434-1008F-1R5J-01
1008F-1R5J-01

Mfr.:

Description:
RF Inductors - SMD Chip Inductor (Wire wound -open); 1.5H; Tol: 5%

Datasheet:
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In Stock: 1.800

Stock:
1.800 Can Dispatch Immediately
Factory Lead Time:
7 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 1800 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- kr.
Ext. Price:
-,-- kr.
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 2000)

Pricing (DKK)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
2,50 kr. 2,50 kr.
2,13 kr. 21,30 kr.
1,96 kr. 49,00 kr.
1,58 kr. 158,00 kr.
1,49 kr. 372,50 kr.
1,28 kr. 640,00 kr.
1,25 kr. 1.250,00 kr.
Full Reel (Order in multiples of 2000)
1,05 kr. 2.100,00 kr.
† A MouseReel™ fee of 47,00 kr. will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
Fastron
Product Category: RF Inductors - SMD
RoHS:  
Wirewound
1.5 uH
5 %
AEC-Q200
1008F
Reel
Cut Tape
MouseReel
Brand: Fastron
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: MY
Mounting Style: PCB Mount
Product: RF Inductors
Product Type: RF Inductors - Leaded
Factory Pack Quantity: 2000
Subcategory: Inductors, Chokes & Coils
Termination Style: SMD/SMT
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Attributes selected: 0

Datasheet

Application Notes

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TARIC:
8504509590
CNHTS:
8504500000
USHTS:
8504508000
ECCN:
EAR99

RF Chip Inductors

Fastron RF Chip Inductors feature a ceramic core and are designed for RF applications that require optimal Q on high-frequency circuits. Fastron RF chip inductors feature gold flash pad metallization to provide better solderability for a higher yield in production, and the encapsulation not only protects the winding but also allows surface mount assembly. Case sizes are available in 0402, 0603, 0805, 1008, 1206, and 1210 with an operating temperature range from -40°C to +125°C. Applications include mobile telecommunication, automotive subsystems, and wireless communication.

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