2508053017Y0

Fair-Rite
623-2508053017Y0
2508053017Y0

Mfr.:

Description:
Ferrite Beads MultLyr Chip Bead 300 OHM 0805 300mA

ECAD Model:
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In Stock: 69.219

Stock:
69.219 Can Dispatch Immediately
Factory Lead Time:
20 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- kr.
Ext. Price:
-,-- kr.
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 4000)

Pricing (DKK)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
0,642 kr. 0,64 kr.
0,455 kr. 4,55 kr.
0,351 kr. 8,78 kr.
0,291 kr. 29,10 kr.
0,254 kr. 63,50 kr.
0,216 kr. 108,00 kr.
0,201 kr. 201,00 kr.
Full Reel (Order in multiples of 4000)
0,142 kr. 568,00 kr.
0,134 kr. 1.072,00 kr.
† A MouseReel™ fee of 47,00 kr. will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Product Attribute Attribute Value Select Attribute
Fair-Rite
Product Category: Ferrite Beads
RoHS:  
25
Ferrite Chip Beads
SMD/SMT
0805 (2012 metric)
300 Ohms
300 mA
25 %
250 mOhms
- 55 C
+ 125 C
2 mm
1.25 mm
0.9 mm
Reel
Cut Tape
MouseReel
Brand: Fair-Rite
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: TW
Product Type: Ferrite Beads
Shielding: Unshielded
Factory Pack Quantity: 4000
Subcategory: Ferrites
Test Frequency: 100 MHz
Type: Multilayer Ferrite Chip Bead
Unit Weight: 5,500 mg
Products found:
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Attributes selected: 0

TARIC:
8504509590
CNHTS:
8548000001
CAHTS:
8548000000
USHTS:
8548000000
JPHTS:
854800000
MXHTS:
85049099
ECCN:
EAR99

Series 25 Multilayer Chip Beads

Fair-Rite Series 25 Multilayer Chip Beads include a broad selection of cost-effective multilayer chip beads to suppress conducted EMI signals. The chip beads are available in standard, high, and GHz signal speeds. These chips are stored and operated at a temperature range of -55°C to +125°C. Fair-Rite Multilayer Chip Beads can be ideally used in devices such as cellular phones, computers, laptops, and pagers. These small package sizes accommodate automated placements and allow for a dense packaging of circuit boards.