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ATS028028018-SF-9Q

Name: Advanced Thermal Solutions ATS028028018-SF-9Q
Brand: Advanced Thermal Solutions
SKU: 984-ATS028028018SF9Q
Price: 48.49 DKK
Availability: OutOfStock

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Mouser No:

984-ATS028028018SF9Q

Mfr. No:

ATS028028018-SF-9Q

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks BGA Heat Sink, Straight Fin, No TIM, Black Anodized, 28x28x18mm (LxWxH)

Datasheet:

ATS028028018-SF-9Q Datasheet (PDF)

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Learn more about Advanced Thermal Solutions ATS028028018-SF-9Q

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 13 Weeks Estimated factory production time.

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Pricing (DKK)

Qty.	Unit Price	Ext. Price
	48,49 kr.	48,49 kr.
	45,80 kr.	458,00 kr.
	43,27 kr.	865,40 kr.
	40,73 kr.	2.036,50 kr.
	38,20 kr.	3.820,00 kr.
	35,96 kr.	7.192,00 kr.
	34,69 kr.	17.345,00 kr.
	33,42 kr.	33.420,00 kr.

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sinks
Designed for:	BGA
Mounting Style:	PCB
Heatsink Material:	Aluminum
Fin Style:	Straight Fin
Thermal Resistance:	4.82 C/W
Length:	28 mm
Width:	28 mm
Height:	18 mm
Brand:	Advanced Thermal Solutions
Color:	Black
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	BGA High Aspect Ratio
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	Value-Line Platform
Type:	Component

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Datasheet

ATS028028018-SF-9Q Datasheet (PDF)

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USHTS:: 7616995100
ECCN:: EAR99

Straight Fin Value-Line Heat Sinks

Advanced Thermal Solutions Straight Fin Value-Line Heat Sinks are high-performance heat sinks with high aspect ratios and are ideal for compact PCB environments. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm with height ranges from 2mm to 25mm with 1mm increments. The straight fin value-line heat sinks can be attached to the devices with double-sided thermal adhesives, Z-clip, or maxiGRIP™ technologies. The higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks. The straight fin design offers an excellent cooling solution for spatially constrained PCB layouts. These straight-fin heat sinks can be applied to various components, including Altera^®, AMD, Freescale, Intel^®, TI, and Xilinx.

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.