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FS820R08A6P2BPSA1

Name: Infineon FS820R08A6P2BPSA1
Brand: Infineon Technologies
SKU: 726-FS820R08A6P2BPS1
Price: 3574.46 DKK
Availability: Discontinued

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Mouser No:

726-FS820R08A6P2BPS1

Mfr. No:

FS820R08A6P2BPSA1

Mfr.:

Infineon Technologies

Description:

IGBT Modules HYBRID PACK DRIVE

Lifecycle:

NRND:

Not recommended for new designs.

Datasheet:

FS820R08A6P2BPSA1 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Infineon Technologies FS820R08A6P2BPSA1

Availability

Stock:: Non-Stocked

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Factory Lead Time:: Request Delivery Quote

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Minimum: 6 Multiples: 6

Unit Price:

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Est. Tariff:

This Product Ships FREE

Pricing (DKK)

Qty.	Unit Price	Ext. Price
	3.574,46 kr.	21.446,76 kr.

Similar Product

Mfr.:

Infineon Technologies

Mfr. No:

FS820R08A6P2BBPSA1

Description:

IGBT Modules HYBRID PACK DRIVE

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Infineon
Product Category:	IGBT Modules
RoHS:
Product:	Hybrid IGBT Modules
Configuration:	6-Pack
Collector- Emitter Voltage VCEO Max:	750 V
Collector-Emitter Saturation Voltage:	1.1 V
Continuous Collector Current at 25 C:	450 A
Gate-Emitter Leakage Current:	400 nA
Pd - Power Dissipation:	714 W
Package/Case:	Module
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 150 C
Packaging:	Tray
Brand:	Infineon Technologies
Maximum Gate Emitter Voltage:	20 V
Mounting Style:	Screw Mount
Product Type:	IGBT Modules
Series:	IGBT EDT2
Factory Pack Quantity:	6
Subcategory:	IGBTs
Technology:	Si
Tradename:	HybridPACK PressFIT
Part # Aliases:	FS820R08A6P2 SP001499702
Unit Weight:	720 g

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Compliance Codes

TARIC:: 8541290000
CNHTS:: 8504409100
CAHTS:: 8541290000
USHTS:: 8541290065
JPHTS:: 8541290100
KRHTS:: 8541299000
MXHTS:: 85412999
ECCN:: EAR99

Origin Classifications

Country of Origin:: Germany
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

750V HybridPACK™ Drive Modules

Infineon Technologies 750V HybridPACK™ Drive Modules are compact power modules optimized for hybrid and electric vehicle main inverter applications (xEV). The HybridPACK modules come with mechanical guiding elements, supporting easy assembly processes. The press-fit pins for the signal terminals avoid time-consuming selective solder processes, which provide cost savings on a system level and increase system reliability.

Automotive HybridPACK™ IGBT Modules

Infineon Technologies Automotive HybridPACK™ IGBT Modules extend across the full power spectrum required in electric and hybrid electric vehicles (EVs/HEVs). These compact modules are available in six RoHS-compliant versions with three base plate options: copper, direct cooled with ribbon bonds, and direct cooled with pin fins. The modules offer an integrated NTC temperature sensor, PressFIT contact technology, and guiding elements for easy PCB and cooler assembly. Other features include high creepage and clearance distances, high power density, and low switching losses. Applications for Infineon Automotive HybridPACK IGBT Modules include EVs, HEVs, motor drives, and commercial agriculture vehicles.